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LOW PRESSURE PLASMA SYSTEMS

In low pressure plasma systems, plasma is generated in an evacuated chamber containing small amounts of the desired precursor gas.  Three-dimensional parts that have different geometries are easily treated.  Two or more steps can be conducted successively, such as surface cleaning and surface coating, or cleaning, etching, and activating.

Low pressure plasma systems are always operated in batch mode, which is ideal for product testing, research, and development.  Nevertheless, their ease of handling, high degree of automation, and a comprehensive range of accessories make Thierry's plasma systems the right choice for highly efficient batch production. 

  • small-scale series production – clean and activate parts before soldering, bonding, or printing
  • analytics - treatment with plasma for SEM (scanning electron microscope) samples  
  • medical technology – a plasma cleaning treatment can sterilize or engineer surface properties (hydrophilic, hydrophobic, and contact angle)

Plasma Treatment

Thierry plasma systems offer many customizable options for plasma treatment.  Options include Femto, Pico, Nano, and Tetra.  All of these systems can be tailored to the plasma treatment desired by the consumer.  These options include:

  • generator size
  • stainless steel or glass (borosilicate or quartz) chamber
  • corrosive gas version
  • semi-automatic control, automatic control, PC control, PCCE control
  • additional gas channels
  • spare parts kit 
  • many more options available

Plasma Treatment Applications

Applications for plasma treatment using low pressure plasma systems include but are not limited to:

  • Automotive
  • Elastomer industry
  • Electronics
  • Micro systems technology
  • Plastics industry
  • Semiconductor industry
  • Textile treatment

Femto Plasma System Version 1

Femto Plasma System Version 1 | Thierry Corp. Plasma Systems

Technical Data:

Control cabinet:
W 13.6 in, H 16.5 in, D 8.3 in
Chamber:
Ø 3.9 in, L 10.9 in
Chamber volume:
approx. 2 liters (.5 gallons)
Gas Supply:
1 gas channel via needle valve

Generator:
1 pc. with 40 kHz
(optional: 13.56 MHz or 2.45 GHz)
Control:
Semi-automatic

Pico Plasma System Version 1

Pico Plasma System Version 1 | Thierry Corp. Plasma Systems

Technical Data:

Control cabinet:
W 22.0 in, H 19.7 in, D 13.0 in
Chamber:
Ø 5.9 in, L 12.6 in
Chamber volume:
approx. 5 liters (1.3 gallons)
Gas Supply:
2 gas channels via needle valves

Generator:
1 pc. with 40 kHz
(optional: 13.56 MHz or 2.45 GHz)
Control:
Semi-automatic

Nano Plasma System Version 1

Nano Plasma System Version 1 | Thierry Corp. Plasma Systems

Technical Data:

Control cabinet:
W 22.0 in, H 23.6 in, D 25.6 in
Chamber:
Ø 10.5 in, L 16.5 in
Chamber volume:
approx. 24 liters (6.3 gallons)
Gas Supply:
2 gas channels via needle valves

Generator:
1 pc. with 40 kHz
(optional: 13.56 MHz or 2.45 GHz)
Control:
Semi-automatic
Plasma Services Learn About Thierry's Plasma Services

Low Pressure Plasma

In a low pressure plasma system, the plasma generating device contains a vacuum chamber, generator, electrode and controls. A vacuum pump is used to reduce the pressure within the plasma chamber. The pressure within the vacuum plasma chamber is generally reduced to approximately 0.1-0.5 mbar. There is also usually a process gas drawn into the chamber to form the plasma, the type of gas depending on the desired plasma treatment and substrate material.

Low Pressure Plasma Systems

Low pressure plasma is always a batch process and has the advantage that all accessible surfaces are equally treated. Parts of any configuration can thus be effectively surface treated. For example, plasma can be used to plasma treat structural components, textiles and powders. Plasma systems may also be used to treat a variety of material types including polymers, metals, glass and ceramics. Research has even been conducted regarding plasma treatment of biological materials such as bird feathers.

Plasma Treatment

Plasma treatment can be used to achieve numerous surface modification objectives. Plasma activation of a surface to make it more adhesive is most commonly achieved by treatment with oxygen as the process gas. Surface activation increases the surface energy of the substrate increasing it’s wettability and adhesiveness. Surface oxide reduction can often be achieved with hydrogen as the process gas. Polymer surfaces can also be rendered hydrophobic using fluorine containing process gases such as sulfur hexafluoride. There are many possibilities available to suit an infinite number of surface treatment objectives.

Plasma Treatment - Process

Plasma treatment systems can also be configured to process numerous part dimensions and throughput objectives. Plasma systems range in size from bench top scale to 3,000+ gallon capacity units able to treat hundreds of square feet per batch. Due to the highly variable system requirements, units can be customized to most efficiently meet any surface modification objective.

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