Plasma Knowledge

Plasma Etching Tailored to the Customer
 
Modern plasma technology is tailored to its specific purposes and is more flexible compared to earlier plasma systems. Additional accessories and specifications can be included into the design and manufacturing of each machine. For example, one plasma etching step may use a gas mixture of four different gases to achieve a desired result. Having the ability to add more gases or to share controllers between multiple gases may be essential in accomplishing certain results.

The size (width, depth, and height) of the plasma etching systems may be manufactured to the desired specifications. In addition, customers of the plasma etching systems may customize the vacuum chamber by choosing the chamber configuration, material, chamber cover, and size. The chamber cover options include a cap or a hinged door. A hinged door may be higher priced, but in a setting such as a university laboratory it is more prudent to have a hinged door instead of a cap. Quartz glass as a material for the vacuum chamber is recommended for medical technology purposes because of its ultra-clean aspects. Some plasma etching systems use thermal conductivity-type mass flow controllers (MFCs) for gas monitoring. MFCs allow for constant adjustment and programmability. Other simpler ways to monitor gas flow is to use a rotameter and fixed flow needle valves.

The tray(s), electrodes, generator, vacuum pump, and optional equipment can also be designed to fit the needs of the customer. The tray type (flat, quartz glass boat, or rotary drum), shape (round or rectangular), material, dimensions and quantity are all specifications that can be selected. The types of control for the plasma etching system are semi-automatic, fully automatic, PCCE-Control, low budget PC-Control, and full PC-Control. All of these control types (with the exception of semi-automatic and fully automatic) also include additional options. The variety of options available results in a plasma etching process tailored to each customer.
Plasma Etcher Parameters
 
Parameters in a plasma etcher can be varied by power, pressure, process time, reactant gas flow, flow ratio of reactants, and temperature. The reactive species in plasma etching systems are important. The following is a list of requirements for the reactive species:High selectivity for etching the desired substrate material and not the masking materialHigh plasma etching rate for the substrate materialGood etching uniformity The pressure of the plasma etcher controls the quantity of ions and free radicals in the chamber. The radio frequency (RF) power input should be chosen in order to obtain the largest etch rate and to minimize undesired etching of other materials.
 
A Plasma System to Suit Each Application & Advantages of Plasma-enhanced Chemical Vapor Deposition (PECVD)Adhesion Science & Adhesion TreatmentsAnisotropic Etching & The Methods and Uses for Anisotropic EtchingApplications of a Plasma Asher & Surface ModificationArgon Plasma & Argon Plasma Role in Micro-SandblastingAtmospheric Pressure Plasma & Applications of Atmospheric Pressure PlasmaBonding Polyethylene & Using Plasma for Bonding PolyethyleneCoating PVD & Advantages and Disadvantages of Coating PVDContact Angle Measurements & How to Measure Contact AnglesCorona Discharge & The Properties of Corona DischargesCorona Treatment & The Differences between Corona Treatment and Atmospheric PlasmaCVD & Plasma Enhanced CVDDifferences between the Types of Plasma Treatments, Specifically Plasma Coating & Plasma Treatments IntroductionDry Etching & Dry Etching vs. Wet EtchingDry Etching (Plasma Etching) and Wet Etching & Advantages and Disadvantages of Dry Etching (Plasma Etching) and Wet EtchingDyne Levels & Determining a Dyne Level Using a Dyne TestDyne Testing & More about Dyne TestingEtching Silicon & How Etching Silicon is DoneEvaporated Coatings & Methods of Applying Evaporated CoatingsHF Etching & Buffered HF EtchingHistory of Plasma Treatment & Why Powder Plasma Treatment?How to Measure Surface Tension & More Methods of Measuring Surface TensionHydrogen H2 Plasma & Oxide-Layer Reduction with Hydrogen PlasmaHydrogen Peroxide Plasma & The Advantages and Uses of Hydrogen Peroxide Plasma SterilizationHydrophilic Treatment & How Hydrophilic Treatment WorksHydrophobic Coatings vs. Hydrophilic Coatings & Uses for Hydrophobic CoatingsInductive Plasma & The Application of Inductive PlasmaIndustries That a Plasma Asher is Used In & Plasma Etch Customer Parts (Plastic, Metal, Glass)Intelligent Textiles & The Possible Applications of Intelligent TextilesIsotropic Etching & Wet Isotropic Etching vs. Dry Isotropic EtchingLength of Activation for Plasma Treatments & Plasma Treatments and Types of Plasma CoatingLow Pressure Plasma Systems & Types of Low Pressure Plasma SystemsMaximizing Coating Adhesion & Applications of Improving Coating AdhesionNanotechnology Fabrics & Nanotechnology Fabric ProcessesNitrogen Plasma & Nitrogen Plasma vs. Oxygen PlasmaOleophobic Coating & Oleophobic Coating Plasma TreatmentOxide Etch & Buffered Oxide Etch vs. Plasma EtchOxygen Plasma Etching & How Oxygen Plasma Etching is AccomplishedPECVD Industrial Applications & PECVD EfficiencyPECVD Is an Improved Method of Chemical Vapor Deposition & Operation of PECVD SystemsPhysical Vapor Deposition & Physical Vapor Deposition ApplicationsPlasma Applications & Plasma applications in Surface ModificationPlasma Asher & How is Plasma Ashing Done?Plasma Asher Tailored to the Customer & Plasma Etchers and SelectivityPlasma Beam & Plasma Beam ApplicationsPlasma Bonding & The Techniques for Plasma BondingPlasma Etching Tailored to the Customer & Plasma Etcher ParametersPlasma Frequency & Ranges of Plasma FrequencyPlasma Gas & Plasma Gas (Partially Ionized Gas) – Degree of IonizationPlasma Generator & Types of Plasma GeneratorsPlasma Surface Modification & Plasma Surface SciencePlasma Surface Technology & Surface Technology CapabilitiesPlasma Treatment of Different Materials & Plasma Treatment of Silica PowderPlasma Treatment of Powder Applications & Experienced Powder TreatmentPlasma Treatment of Textiles & Plasma Treatment of Textiles: Medical and Technological ApplicationsPlasma Treatment Services & The Use of Corona and Plasma Treatment to Modify Contact AnglePlasma Treatment Systems & Plasma TreaterPlasma Treatments and the History of Plasma & Plasma Treat Different MaterialsPowder Treatment for the Customer & Industries that Need Powder TreatmentSteps of Dry Etching (Plasma Etching) and Wet Etching & Dyne Levels and Plasma Etching TechnologiesSurface Coating with PECVD System & Applications of PECVD SystemsSurface Treatments & Uses for Surface TreatmentsThierry Plasma Systems & What is Plasma-enhanced chemical vapor deposition (PECVD)?What Industries Plasma Etching Is Used In & Plasma Etching MechanismsWhat is a Plasma Asher? & Differences between Plasma Etch and Plasma AshWhat is Plasma Density? & Plasma Density: Cold and Hot PlasmaWhat is Plasma Treatment? & Plasma Treatment of Powders

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