Thierry Plasma Systems
 
Thierry provides plasma systems for modifying the surface properties of substrates of various materials (metals, plastics, glass, textiles, etc.). There are a variety of ways to prepare a surface for a subsequent process or for a final finish using plasma. These surface modifications include cleaning or sterilization, etching microscopic patterns, activation or application of coatings to the substrates.

These treatments can alter mechanical, electronics, optical properties as well as enable them to be used for a variety of applications in various fields, from medicine to aerospace engineering. Plasma systems can also be used to create a hydrophobic or hydrophilic coating. One technique for applying these coatings is chemical vapor deposition (CVD). Thierry’s plasma systems make it possible to improve this CVD technique with the plasma-enhanced mode (PECVD). With this method the rate of deposition is higher and operating temperatures is lower than in conventional CVD, so the thermal stress on the workpiece is considerably reduced.
What is Plasma-enhanced chemical vapor deposition?
 
Plasma-enhanced chemical vapor deposition (PECVD) allows you to deposit thin films of a variety of materials (pure elements, such as carbon or silicon, or oxides, sulfides, nitrides, etc.) on a substrate. This method of plasma coating works by supplying electric power (RF, microwave, etc.) to a gas mixture to produce plasma whose components may react on the substrate or in the gas phase. In any case, the result of the reaction is the deposition of surface film of uniform thickness and quality onto the substrate. High PECVD deposition rates can be achieved even at low temperatures, which is ideal when working with substrates that are thermally sensitive.
 
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