Plasma asher is used to etch materials such as silicon wafers. A plasma asher is also referred to as a plasma etcher. The use of an asher is often used to remove layers of photoresist by etching the surface of semiconductors devices. The etching of these materials is done in a plasma chamber most often by oxygen or fluorine gases. With a plasma asher, parts can be etched to one micron per minute with up to 25 wafers being treated at one time. This process produces great uniformity within the materials.

Please visit our plasma etching page for more information.

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