Advantages of PECVD

Advantages of PECVD

Plasma from Thierry Corporation | Advantages of Plasma-enhanced Chemical Vapor Deposition

A Plasma System to Suit Each Application

Thierry, a leader in plasma systems in North America, offers its customers plasma systems that can be adjusted (on request) to suit their needs, depending on the application and the results the customers desire. Among the processes that Thierry plasma systems can achieve is plasma-enhanced chemical vapor deposition (PECVD), a type of plasma coating, with enormous potential benefits offered in the wide variety of applications in which it can be leveraged. Using a plasma system accelerates the coating process and reduces the thermal shock on the workpieces, which is particularly important when working with sensitive substrates at elevated temperatures.

Advantages of Plasma-enhanced Chemical Vapor Deposition

PECVD is a technique designed to create thin or ultrathin films on the surface of a substrate. Some advantages offered by this plasma coating technique are: (1) the ability to deposit a variety of materials on the substrate or workpiece to confer specific properties (e.g., diamond-like carbon to reduce wear of parts, or silicon compounds with insulating properties, such as SiO2 or Si3N4, on electronic devices); (2) operation at low temperatures, which is suitable for heat-sensitive substrates; (3) thin films of high quality, uniform thickness and resistance to cracking; (4) good adhesion of the film to the substrate; (5) the ability to coat even complex geometry parts, and (6) high rates of deposition.

To learn more about the use of plasma in manufacturing, please read our eBook titled "Manufacturer’s Surface Activation Guide for Improved Adhesion."


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