Chemical Vapor Deposition - Plasma coating process • Plasma Enhanced CVD
Chemical vapor deposition is a plasma coating process that Thierry can perform using its low-pressure plasma systems. Chemical vapor deposition (CVD) is capable of depositing extremely thin layers onto surfaces. This is achieved by heating the surface to a high temperature before a monomer is channeled into the chamber. The monomer then leaves a small coat of whatever material the manufacturer wishes to use. CVD is used within the field of semiconductors to produce very thin films or coatings on the surfaces. Often surfaces are coated with layers of carbon, silicon, carbon nanotubes, silicon carbide, silicon nitride. CVD can also be used to produce synthetic diamonds.
Plasma Enhanced CVD
Plasma enhanced chemical vapor deposition (PECVD) is a superior form of CVD. In this process plasma is used to accelerate the process of coating surfaces. Thierry’s plasma coaters are capable of performing CVD relatively easily and it does not require the object being treated to undergo as much thermal stress.