Hydrogen Plasma - Proficient cleaning of surfaces • Oxide-Layer Reduction
Plasma technology is very versatile and Thierry is capable of providing a large variety of processes by employing the different attributes of several types of plasma, such as
hydrogen plasma. Hydrogen exists as a highly combustible, diatomic gas with the molecular formula of H_2. When introduced into a
low pressure plasma system, the hydrogen atoms disassociate and ionize, while changing phase into plasma.
Hydrogen plasma radiates a purple glow that can be observed in our low-pressure systems. The
hydrogen plasma is then capable of proficiently cleaning surfaces by targeting and removing impurities.
Oxide-Layer Reduction with Hydrogen Plasma
In the production of electronics, it is important for small metal parts to be precisely bonded and soldered. The first step in that process is cleaning those parts and
hydrogen plasma is an efficient and environmentally friendly way to do so. On base metals, oxide layers form onto surfaces within minutes. This oxide layer hinders the ability for the metal to be bonded or soldered.
Hydrogen plasma is a very strong reducing agent and has the capability to remove oxide from the surface of metals. Reducing agents work by donating an electron to another substance during a chemical reaction. In a
hydrogen plasma process, the
hydrogen plasma gives many electrons to the surface of the material which reduces the oxide and makes the surface more reactive and ready to be properly bonded or soldered.