Plasma Cleaning

Plasma_Cleaning

Microscopic contaminations not visible to the naked eye are found on all surfaces. Almost always, these contaminants must be removed as a first step to producing faultless adhesion between surfaces when working in the application of gluing, printing, painting, bonding, or coating.

Plasma Cleaning Functional Principles

Plasma cleaning technology offers solutions for any type of contamination, for any substrate. In the cleaning process, molecular level contamination residues are removed from a surface by a dry method of turning the foriegn materials into a gas. This process of changing the state of a solid or smearable liquid into a gas without exposing the part to a liquid is prefered over standard cleaning methods.

With a plasma cleaner there are virtually no limitations for materials that can be treated. Polymers (solid or fibers), metals, rubbers, ceramics and glass are equally suitable for plasma cleaning. It is safer, environmentally friendly, and more effective than traditional wet chemical cleaning procedures.

plasma_cleaning_function

Oxygen-Based Plasma Cleaning

Oxygen (O2) plasma reacts with carbon and hydrogen molecules in a hydrocarbon based foreign contaminant on the surface of the part.  This contaminate is changed into a gas state and removed from the  workpiece without the application of a fluid.

Hydrogen-Based Plasma Cleaning

Hydrogen Plasma (H2) is a powerful reducing agent. Hydrogen plasma is used to clean or reduce oxides from the surface of  metals or bulk oxide films.

Argon-Based Plasma Cleaning

Unlike oxygen and hydrogen, argon (Ar) is not chemically reactive, but the comparatively heavy argon ions generated in the plasma system have a lot of energy and exercise a micro-sandblast effect where they hit the surface. This will plasma clean and activate it for subsequent production steps. Argon plasma alone or in combination with other gases can speed up other manufacturing processes.

eBook

Plasma Etching and Cleaning Strategy for Better Product Quality

Plasma Cleaning Industries & Uses

Plasma cleaning systems are used in many industries and applications:

  • Automotive: Plasma cleaning is applied to the application of surface preparation prior to the application of a sealant, adhesive or coating. The ability to do this in an environmentally friendly, high volume, low takt time process.
  • Aerospace: Plasma cleaning is used to produce ultra-clean surfaces in propellant and oxidizer valving, pumping and other hardware prior to assembly. The ultra-clean process capability is used extensively in Aerospace applications.
  • Consumer Goods: Plasma cleaning and activation is applied to the preparation of polymer and composite components prior to adhesive application to improve bond strength
  • Electronics: Plasma cleaning is employed to reduce oxides, clean and degrease metal surfaces prior to bonding, soldering, circuit printing, or conformal coating
  • Medical Devices: Cleaning and sterilization of implants and stents
  • Semiconductor: Plasma cleaning and activation is applied to wafers, bond pads and lead frames to promote adhesion and improve reliability of secondary processes
  • Solar: Plasma cleaning is used to clean bond pads and conductive materials for improved conductivity and reliability of device and package electrical connections
  • Textiles: Plasma cleaning and activation is used to remove manufacturing contamination from textiles to improve coating durability and performance life
  • Rubber Processors: Removal of mold release and lubricants prior to gluing or bonding

Popular Plasma Cleaning Systems

{id=1, name='Femto', order=0}

Femto Version 3

Control Cabinet:
W 310 mm H 330 mm D 420 mm

Chamber:
Ø 3.9 in, L 10.9 in

Chamber Volume:
2

Gas Supply:
2 gas channel via needle valve

Generator:
1 pc. with 40 kHz
(optional: 13.56 MHz or 2.45 GHz)

Control:
Semi-Automatic

{id=3, name='Nano', order=2}

Nano Version 4

Control Cabinet:
W 560 mm H 600 mm D 600 mm

Chamber:
Ø 10.5 in, L 16.5 in

Chamber Volume:
24

Gas Supply:
Mass flow controllers

Generator:
1 pc. with 40 kHz
(optional: 13.56 MHz or 2.45 GHz)

Control:
Touch Screen

{id=4, name='Tetra', order=3}

Tetra 100 PCCE

Control Cabinet:
W 600 mm H 1700 mm D 800 mm

Chamber:
W 15.8" x H 15.8" x D 24.6"

Chamber Volume:
100

Gas Supply:
Mass flow controllers

Generator:
1 pc. with 40 kHz
(optional: 13.56 MHz or 2.45 GHz)

Control:
Touch Screen

{id=8, name='Atto', order=7}

Atto Version 3

Control Cabinet:
W 425 mm H 275 mm D 450 mm

Chamber:
Ø 8.3 in, L 11.8 in

Chamber Volume:
10.5

Gas Supply:
Mass flow controllers

Generator:
1 pc. with 40 kHz
(optional: 13.56 MHz)

Control:
Touch Screen

{id=10, name='Plasma Beam', order=9}

Plasma Beam

Control Cabinet:
W 562 mm H 211 mm D 450 mm

Generator:
1 pc. with 40 kHz

Control:
Semi-Automatic

{id=12, name='Plasma Beam Duo', order=11}

Plasma Beam Duo

Control Cabinet:
W 562 mm H 360 mm D 650 mm

Generator:
1 pc. with 40 kHz

Control:
PC

Workshop

Learn about a Plasma Processing Workshop