Plasma Knowledge

What Industries Plasma Etching Is Used In
Plasma technology is used to change the surfaces of many different materials. It is more environmentally friendly compared to wet cleaning and etching due to less waste disposal. The following is a list of various uses of plasma technology:
  • Remove organic and inorganic contaminants
  • Increase wettability and adhesion
  • Increase bond strength
  • Remove residue
One example of using plasma technology, specifically plasma etching, is gluing plastics. Plastics are normally difficult to lacquer or glue. However, with plasma etching, the surface area of the plastic can be increased and its microstructure changes, resulting in a better bonding between the plastic and the adhesive.

The medical, manufacturing, and electronic industries benefit from plasma etching to make reliable and durable products. A plasma etching process is essential in medical industries because medical equipment like catheters and filters need to be safe and sterile. Manufacturing companies want clean and oxide-free surfaces on the metals prior to gluing or bonding. In the electronics industry, printed circuit boards often need to be plasma etched prior to soldering.
Plasma Etching Mechanisms
Plasma etching is separated into four mechanisms. One mechanism is sputtering. Sputtering occurs when positive ions are accelerated across the plasma sheath and hit the substrate material. Some material is removed as a result due to the kinetic energy that was transferred onto the surface atoms which are removed from the surface. This mechanism differs from the other three plasma etching mechanisms because the interaction is only mechanical. Some disadvantages of sputtering are the lack of selectivity and slow etching rates. Selectivity is the reactive species’ capability to remove solely the material that is supposed to be removed and to avoid removing the masking material (along with the substrate material underneath). The masking material’s purpose is to prevent plasma etching in that area.

Another method of plasma etching is chemical. The only purpose of the plasma is to provide gaseous etchant species. Ions do not hit the substrate material in this mechanism. Active species in the gas phase react with substrate material in order to form a volatile product. Because of the fact that undesired side reactions will be less likely to happen under certain conditions (by changing the temperature or amount of reactants for example), chemical etching is more selective than the other three mechanisms.

Ion-enhanced energetic and ion-enhanced inhibitor mechanisms involve encounters of both neutral species and ions on the surface. The combination of neutral species and ions can cause more substrate material to be removed than the chemical or sputtering mechanisms separately. In ion-enhanced energetic mechanisms, neutral species have negligible or no affect until ions increase the reactivity of the substrate material with the neutral species.

The plasma (from the plasma etching system) provides etchants for chemical etching, ions for anisotropic etching, and inhibitor precursor molecules that adsorb or deposit on the substrate material and form an inhibitor layer. This inhibitor layer can stop etching reactions from occurring. In the ion-enhanced inhibitor mechanism, the ions that hit the surface prevent an inhibitor layer from forming and remove the barrier layer, which means the surface is exposed to plasma etchants for plasma etching.
A Plasma System to Suit Each Application & Advantages of Plasma-enhanced Chemical Vapor Deposition (PECVD)Adhesion Science & Adhesion TreatmentsAnisotropic Etching & The Methods and Uses for Anisotropic EtchingApplications of a Plasma Asher & Surface ModificationArgon Plasma & Argon Plasma Role in Micro-SandblastingAtmospheric Pressure Plasma & Applications of Atmospheric Pressure PlasmaBonding Polyethylene & Using Plasma for Bonding PolyethyleneCoating PVD & Advantages and Disadvantages of Coating PVDContact Angle Measurements & How to Measure Contact AnglesCorona Discharge & The Properties of Corona DischargesCorona Treatment & The Differences between Corona Treatment and Atmospheric PlasmaCVD & Plasma Enhanced CVDDifferences between the Types of Plasma Treatments, Specifically Plasma Coating & Plasma Treatments IntroductionDry Etching & Dry Etching vs. Wet EtchingDry Etching (Plasma Etching) and Wet Etching & Advantages and Disadvantages of Dry Etching (Plasma Etching) and Wet EtchingDyne Levels & Determining a Dyne Level Using a Dyne TestDyne Testing & More about Dyne TestingEtching Silicon & How Etching Silicon is DoneEvaporated Coatings & Methods of Applying Evaporated CoatingsHF Etching & Buffered HF EtchingHistory of Plasma Treatment & Why Powder Plasma Treatment?How to Measure Surface Tension & More Methods of Measuring Surface TensionHydrogen H2 Plasma & Oxide-Layer Reduction with Hydrogen PlasmaHydrogen Peroxide Plasma & The Advantages and Uses of Hydrogen Peroxide Plasma SterilizationHydrophilic Treatment & How Hydrophilic Treatment WorksHydrophobic Coatings vs. Hydrophilic Coatings & Uses for Hydrophobic CoatingsInductive Plasma & The Application of Inductive PlasmaIndustries That a Plasma Asher is Used In & Plasma Etch Customer Parts (Plastic, Metal, Glass)Intelligent Textiles & The Possible Applications of Intelligent TextilesIsotropic Etching & Wet Isotropic Etching vs. Dry Isotropic EtchingLength of Activation for Plasma Treatments & Plasma Treatments and Types of Plasma CoatingLow Pressure Plasma Systems & Types of Low Pressure Plasma SystemsMaximizing Coating Adhesion & Applications of Improving Coating AdhesionNanotechnology Fabrics & Nanotechnology Fabric ProcessesNitrogen Plasma & Nitrogen Plasma vs. Oxygen PlasmaOleophobic Coating & Oleophobic Coating Plasma TreatmentOxide Etch & Buffered Oxide Etch vs. Plasma EtchOxygen Plasma Etching & How Oxygen Plasma Etching is AccomplishedPECVD Industrial Applications & PECVD EfficiencyPECVD Is an Improved Method of Chemical Vapor Deposition & Operation of PECVD SystemsPhysical Vapor Deposition & Physical Vapor Deposition ApplicationsPlasma Applications & Plasma applications in Surface ModificationPlasma Asher & How is Plasma Ashing Done?Plasma Asher Tailored to the Customer & Plasma Etchers and SelectivityPlasma Beam & Plasma Beam ApplicationsPlasma Bonding & The Techniques for Plasma BondingPlasma Etching Tailored to the Customer & Plasma Etcher ParametersPlasma Frequency & Ranges of Plasma FrequencyPlasma Gas & Plasma Gas (Partially Ionized Gas) – Degree of IonizationPlasma Generator & Types of Plasma GeneratorsPlasma Surface Modification & Plasma Surface SciencePlasma Surface Technology & Surface Technology CapabilitiesPlasma Treatment of Different Materials & Plasma Treatment of Silica PowderPlasma Treatment of Powder Applications & Experienced Powder TreatmentPlasma Treatment of Textiles & Plasma Treatment of Textiles: Medical and Technological ApplicationsPlasma Treatment Services & The Use of Corona and Plasma Treatment to Modify Contact AnglePlasma Treatment Systems & Plasma TreaterPlasma Treatments and the History of Plasma & Plasma Treat Different MaterialsPowder Treatment for the Customer & Industries that Need Powder TreatmentSteps of Dry Etching (Plasma Etching) and Wet Etching & Dyne Levels and Plasma Etching TechnologiesSurface Coating with PECVD System & Applications of PECVD SystemsSurface Treatments & Uses for Surface TreatmentsThierry Plasma Systems & What is Plasma-enhanced chemical vapor deposition (PECVD)?What Industries Plasma Etching Is Used In & Plasma Etching MechanismsWhat is a Plasma Asher? & Differences between Plasma Etch and Plasma AshWhat is Plasma Density? & Plasma Density: Cold and Hot PlasmaWhat is Plasma Treatment? & Plasma Treatment of Powders

Contact form light

Contact Request
**required if you want a callback