Plasma asher is used to etch materials such as silicon wafers. A plasma asher is also referred to as a plasma etcher. The use of an asher is often used to remove layers of photoresist by etching the surface of semiconductors devices. The etching of these materials is done in a plasma chamber most often by oxygen or fluorine gases. With a plasma asher, parts can be etched to one micron per minute with up to 25 wafers being treated at one time. This process produces great uniformity within the materials.

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