Physical Vapor Deposition

Physical Vapor Deposition

Physical Vapor Deposition - Plasma units • PVD applications • Coating for metalworking

Physical vapor deposition, otherwise known as  PVD, is a coating process that takes solid materials and evaporates them to deposit thin coatings down to the atomic level onto a desired surface.  Physical vapor deposition is used for several purposes.  PVD can improve hardness and wear resistance, reduce friction of mechanical parts, and slow down the oxidation process of metal surfaces.  PVD is a completely physical process. It can be accomplished by using high temperature vacuum evaporation and condensation, or can be done by using a technique called plasma sputter coating.

Physical Vapor Deposition Applications

Physical vapor deposition is utilized in the manufacturing of many items and for many purposes. Common materials that can be applied as a coating using  physical vapor deposition are titanium nitride, zirconium nitride, chromium nitride, and titanium aluminum nitride.  PVD is an important step in many manufacturing processes including the fabrication of semiconductor devices and coated cutting tools. They make parts or surfaces harder, more corrosion resistant, and abrasion resistant.  PVD coatings can be useful in almost all scientific fields including, aerospace, automotive, surgical, optics, etc.

To learn more about the use of plasma in manufacturing, please read our eBook titled "Manufacturer’s Surface Activation Guide for Improved Adhesion."


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