Physical vapor deposition, or PVD, is a term used to describe any method of depositing thin films by the condensation of a vaporized material onto various surfaces. This coating method is a purely physical process using plasma bombardment rather than using a chemical reaction at the surface as in chemical vapor deposition (CVD). Physical vapor deposition is used in the manufacturing of semiconductor devices and coated cutting tools for metalworking.

Plasma Services

Learn About Thierry's Plasma Services Read More

Connect With Thierry

Do you have questions or comments for us?  Send us an email or request a call back and a Thierry representative will get back with you as soon as possible.

Contact Us