PHYSICAL VAPOR DEPOSITION (PVD)

Physical vapor deposition, or PVD, is a term used to describe any method of depositing thin films by the condensation of a vaporized material onto various surfaces. This coating method is a purely physical process using plasma bombardment rather than using a chemical reaction at the surface as in chemical vapor deposition (CVD). Physical vapor deposition is used in the manufacturing of semiconductor devices and coated cutting tools for metalworking.

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